TSMC says AI demand can run to 2030 – lifting the outlook for air cargo
The AI infrastructure boom looks set to keep air cargo demand elevated for years, after ...
UPS: REMEMBER THE TAILWINDS PLD: OUCHVW: NEW PARTNERS SOUGHTEXPD: AIRCRAFT ON GROUND SERVICESTSLA: JUST AS VW STRUGGLESBA: NEW BIG ORDERBA: THE ORDERBOOK GROWSPLD: PUSHING FOR A DEAL PLD: TIME TO DEALEXPD: ANOTHER ALL-TIME HIGH CHRW: NEW RECORD DSV: AHEAD OF EARNINGS RELEASE JBHT: NEW HIGHS EVERYWHEREPLD: STRONG DELIVERYJBHT: FAIR-VALUE CONSENSUS ESTIMATE AT ALL-TIME HIGH
UPS: REMEMBER THE TAILWINDS PLD: OUCHVW: NEW PARTNERS SOUGHTEXPD: AIRCRAFT ON GROUND SERVICESTSLA: JUST AS VW STRUGGLESBA: NEW BIG ORDERBA: THE ORDERBOOK GROWSPLD: PUSHING FOR A DEAL PLD: TIME TO DEALEXPD: ANOTHER ALL-TIME HIGH CHRW: NEW RECORD DSV: AHEAD OF EARNINGS RELEASE JBHT: NEW HIGHS EVERYWHEREPLD: STRONG DELIVERYJBHT: FAIR-VALUE CONSENSUS ESTIMATE AT ALL-TIME HIGH
Taiwan Semiconductor Manufacturing Co (TSMC) is said to be in discussions with Wan Hai to charter a containership to move components from Kaohsiung to the US, following the lead of Home Depot and Walmart.
Up to 5,000 containers, laden with components for building the clean room at TSMC’s new Phoenix, Arizona, plant are expected to be loaded onto a vessel in October at a cost, based on current spot freight rates for the Asia-US west coast route, of at least $107m. Based on Phoenix’s proximity to Los Angeles, it is likely that the cargo will be bound for the west coast.
To help with the costs, TSMC has, apparently, through clean room contractor United Integrated Services initiated discussions with Wan Hai Lines.
Unconfirmed media reports claim TSMC chairman Mark Liu has approved plans to charter a whole vessel, but the company and Wan Hai both told The Loadstar they would not comment.
Taiwanese media reports said TSMC, the world’s largest contract chipmaker, said the Phoenix plant is expected to start producing ‘5-nanometer’ chips in 2024. The firm, whose clients include Apple, Nvidia and Intel, is investing $100bn over the next three years to expand semiconductor fabrication capacity.
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Paul Manoli
August 30, 2021 at 11:02 pmExcellent idea.